PURPOSE: To obtain a molded body, used for integrated modules of electrical and electronic apparatuses and suitable for mounting integrated modules of the various electrical and electric parts such as a case, a card or a sheet and a surface mount technology (SMT)-responding molded body, used for the electrical and electronic apparatuses, forced to the adhesion to sealing media and suitable for high-density mounting such as the case, card or sheet.

CONSTITUTION: These molded body used for integrated modules of electrical and electronic apparatuses and SMT-responding molded body used therefor are obtained by molding 100 pts.wt. polyarylene sulfide resin composition having substantially thermally oxidizing uncrosslinked polyarylene sulfides, 1-25 pts.wt. ethylenic copolymer containing 50-90wt.% ethylene, 5-49wt.% alkyl α,β-unsaturated carboxylate and 0.5-10wt.% maleic anhydride as monomer units and 25-150 pts.wt. reinforcing filler.