Title:
RADIATION SENSITIVE POSITIVE COMPOSITION AND MANUFACTURE OF RESIST PATTERN BY USING THE SAME
Document Type and Number:
Japanese Patent JP2000292928
Kind Code:
A
Abstract:
To provide a radiation sensitive positive composition having a resolution capable of microfabricating a subquarter micron pattern and high sensitivity.
This radiation sensitive positive composition contains a polymer having structural units each represented by formula I and an acid generator to be induced to produce an acid by irradiation with radiation, and in formula I, A is an organic group to be decomposed by action of the acid and to produce an alkali soluble group and has at least ≥1 silyl group, and X is a halogen atom or a cyano group.
Inventors:
NIO HIROYUKI
TAMURA KAZUTAKA
OBAYASHI GENTARO
TAMURA KAZUTAKA
OBAYASHI GENTARO
Application Number:
JP2000011358A
Publication Date:
October 20, 2000
Filing Date:
January 20, 2000
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H01L21/027; G03F7/039; G03F7/075; (IPC1-7): G03F7/039; G03F7/075; H01L21/027