Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2023145463
Kind Code:
A
Abstract:
To provide a radiation-sensitive resin composition that, when applied to the next-generation exposure techniques, can exhibit sufficient levels of sensitivity, depth of focus, and process margins, and a method for forming a resist pattern.SOLUTION: A radiation-sensitive resin composition contains a resin including a structural unit having a phenolic hydroxyl group; and a compound represented by formula (1). In the formula (1), Ar is a substituted or unsubstituted aromatic ring having 6 to 20 carbon atoms; n is an integer of 2 to 4; Z+ is a monovalent onium cation; a plurality of Y's are each independently a polar group).SELECTED DRAWING: None
Inventors:
NISHIGORI KATSUTOSHI
MORI HIDETO
SUZUKI JUNYA
NAKAJIMA HIROMITSU
MORI HIDETO
SUZUKI JUNYA
NAKAJIMA HIROMITSU
Application Number:
JP2023110552A
Publication Date:
October 11, 2023
Filing Date:
July 05, 2023
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C07C65/05; C07C65/11; C07C309/04; C07C309/12; C07C309/17; C07C381/12; C09K3/00; G03F7/039
Attorney, Agent or Firm:
Patent Attorney Corporation Junias International Patent Office