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Title:
冷媒回路装置
Document Type and Number:
Japanese Patent JP6822007
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To change a refrigerant flow rate ratio in accordance with various operating conditions and thus improve operation efficiency even when flow rates of refrigerants in a low-stage compression section and a high-stage compression section of a compressor cannot be controlled independently.SOLUTION: A refrigerant circuit device includes a refrigerant circuit 10 constituted by connecting a compressor 21 driven in a form in which a rotational speed ratio between a low-stage compression section 21a and a high-stage compression section 21b is constant, a condenser 22, a high-stage expansion valve 23, a gas-liquid separator 24, intermediate piping 2g and the like for sucking a gas-phase refrigerant separated from the gas-liquid separator 24 to the high-stage compression section 21b, a low-stage expansion valve 25 for decompressing and expanding a liquid-phase refrigerant separated by the gas-liquid separator 24 to lower the pressure and an evaporator 26 by using a refrigerant pipe line. The refrigerant circuit device further includes: a heating amount adjustment mechanism for adjusting heating amount of an intermediate-pressure refrigerant flowing in the intermediate piping 2g and the like; and a control section 50 for controlling heating amount obtained by the heating amount adjustment mechanism in accordance with a comparison result between the density of the refrigerant heated by the heating amount adjustment mechanism and a target value preset based on an operating condition.SELECTED DRAWING: Figure 1

Inventors:
Atsushi Nakamura
Kensetsu Yasushima
Application Number:
JP2016160342A
Publication Date:
January 27, 2021
Filing Date:
August 18, 2016
Export Citation:
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Assignee:
Fuji Electric Co., Ltd.
International Classes:
F25B1/10; F25B1/00; F25B27/02
Domestic Patent References:
JP2005147456A
JP2014016079A
JP2010216686A
JP2014190613A
Attorney, Agent or Firm:
Sakai International Patent Office