To provide a pressure-sensitive adhesive which excels in the balance of adhesion and readhesion, excels in workability and designing properties, and is particularly suitably used as a pressure-sensitive adhesive for functional films, and a resin composition of the photosensitive type to be used in the pressure-sensitive adhesive.
The resin composition comprises (A) an acrylic copolymer having a weight average molecular weight of 200,000-500,000, (B) a monomer having two unsaturated double bonds in the molecule and an alkylene glycol chain in the molecule, and (C) a photopolymrization initiator, and the pressure-sensitive adhesive excellent in the balance of adhesion and readhesion and in workability and designing properties is prepared by irradiating the above composition with ultraviolet rays.
HAMADA KEIJI
KONDO SHUICHI
SHINTANI KENICHI
| JP2002229191A | 2002-08-14 | |||
| JP2002241708A | 2002-08-28 |