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Title:
RESIN COMPOSITION COMPRISING POLYNORBORNENE AND ITS DERIVATIVE
Document Type and Number:
Japanese Patent JP2003055520
Kind Code:
A
Abstract:

To obtain a resin composition with a low dielectric constant, having excellent adhesion and usable as an interlayer insulation film and a printed circuit board or an LSI.

The resin composition comprises a polynorbornene and/or a derivative thereof, and an alkoxysilane represented by formula (1) [R1 and R2 are each a monovalent organic group, and may be same or different; R3 and R4 are each a 1-5C alkyl group, and may be same or different; and (a), (b) and (c) are each an integer of 0-3 with the proviso that (a)+(b)+(c) is 1-3].


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Inventors:
SHINBA YOICHI
OTAKE ATSUYUKI
MORI YOICHI
Application Number:
JP2001249054A
Publication Date:
February 26, 2003
Filing Date:
August 20, 2001
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08L45/00; C08F32/08; C08K5/5419; H01B3/44; (IPC1-7): C08L45/00; C08F32/08; C08K5/5419; H01B3/44



 
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