Title:
RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2023180707
Kind Code:
A
Abstract:
To provide a resin composition capable of forming a cured product having excellent press moldability, sufficiently maintaining low dielectric constant and low dielectric loss tangent, and having excellent adhesiveness to copper foil.SOLUTION: A resin composition according to the present disclosure includes a bismaleimide resin (A) obtained by reacting tetracarboxylic dianhydride (a1), a diamine containing dimer diamine (a2), and maleic anhydride (a3), inorganic hollow particles (B), a rubber (C), and a polymerization initiator (D).SELECTED DRAWING: None
Inventors:
SATO KITARU
Application Number:
JP2022094235A
Publication Date:
December 21, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
H05K1/03; B32B27/34; C08G73/12; C08K7/24; C08K7/26; C08L21/00; C08L79/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Mayumi Shinoda
Yoshinori Shimizu
Hiroyuki Hirano
Mayumi Shinoda