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Patent Searching and Data


Title:
RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH09104730
Kind Code:
A
Abstract:

To obtain a resin composition used for e.g. a resistor pattern which can be developed with a dilute aqueous alkali solution in a good pattern precision, leaves little organic residue when fired and has excellent adhesion and to obtain a cured product thereof.

A resin composition containing a carboxylic rosin compound and/or a phenolic resin, a diluent, a photopolymerization initiator and one or more members selected from among a metallic powder, a metal oxide and glass, and a cured product of the composition are provided.


Inventors:
MORI SATORU
YOKOSHIMA MINORU
Application Number:
JP28819395A
Publication Date:
April 22, 1997
Filing Date:
October 11, 1995
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08K3/08; C08F290/00; C08F299/02; C08K3/22; C08K3/40; C08L61/04; C08L61/06; C08L93/00; C08L93/04; H05K1/09; H05K3/02; (IPC1-7): C08F299/02; C08K3/08; C08K3/22; C08K3/40; C08L61/06; C08L93/04