Title:
RESIN COMPOSITION FOR EXTRUSION MOLDING
Document Type and Number:
Japanese Patent JP2005162953
Kind Code:
A
Abstract:
To obtain a resin composition having a heat-resistance higher than that of a polyphenylene sulfide resin and enabling the production of a large-sized article having extremely little void/crack defects in high efficiency by extrusion molding.
This resin composition for extrusion molding is produced by compounding (A) a non-crosslinked straight-chain polyphenylene sulfide resin having a melt flow rate of ≤150 g/10 min measured under 5 kg load after leaving the resin at 315.5°C for 5 min, (B) an aromatic polyamide imide resin and (C) a fibrous filler. The amounts of the components (A), (B) and (C) are 30-70 pts.wt., 70-30 pts.wt. and 20-80 pts.wt. based on 100 pts.wt. of A+B, respectively.
Inventors:
NAGANO HIROSHI
AKAIKE KATSUMI
MATSUTANI YOSHIFUSA
AKAIKE KATSUMI
MATSUTANI YOSHIFUSA
Application Number:
JP2003406598A
Publication Date:
June 23, 2005
Filing Date:
December 04, 2003
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L81/02; C08K7/02; C08L79/08; (IPC1-7): C08L81/02; C08K7/02; C08L79/08