Title:
RESIN COMPOSITION AND FILAMENTOUS MOLDING FOR 3D PRINTER
Document Type and Number:
Japanese Patent JP2021130250
Kind Code:
A
Abstract:
To provide a resin composition and a filament made of the resin composition excellent in moldability, whose molded article has small warpage, and excellent in mechanical properties when used in a 3D printer of a hot-melt lamination method.SOLUTION: A resin composition for a 3D printer includes 1 wt.% or more and 99 wt.% or less of biodegradable resin (A), and 1 wt.% or more and 99 wt.% or less of ethylene-vinyl acetate copolymer (B) (wherein a total of (A) and (B) is 100 wt.%). It is preferable that the composition is used in a filament shape.SELECTED DRAWING: None
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Inventors:
KUGIMOTO HIROSHI
KODA SHINGO
KODA SHINGO
Application Number:
JP2020026903A
Publication Date:
September 09, 2021
Filing Date:
February 20, 2020
Export Citation:
Assignee:
TOSOH CORP
International Classes:
B29C64/118; B33Y70/00; C08L23/08; C08L31/04; C08L67/04; C08L101/02
Domestic Patent References:
| JP2019026702A | 2019-02-21 | |||
| JP2019531214A | 2019-10-31 | |||
| JP2008056783A | 2008-03-13 | |||
| JP2019172924A | 2019-10-10 | |||
| JP2016532579A | 2016-10-20 | |||
| JPH07316367A | 1995-12-05 |
Foreign References:
| WO2018110685A1 | 2018-06-21 |