To provide a positive type photosensitive resin composition which has portions capable of being dissolved in an alkali aqueous solution when exposed to ultraviolet rays and is suited in use for a surface protective film and an interlaminar insulating film of a semiconductor device, an insulating film of an organic electroluminescent element and the like.
The resin composition comprises a compound composed of a structural unit to be represented by formula (1) (wherein n is an integer of 1-2; R1 to R4 are each any one of H, F, CF3, a 1-10C alkyl group, and a 6-20 aryl group and may be the same or different; R5 and R6 are each H or a 1-10C alkyl group and may be the same or different; and Ra is a substituent) and/or a precursor of the structural unit to be represented by formula (1) as component (a) and, simultaneously, at least one functional group selected from a carboxyl group, a phenolic hydroxyl group, a sulfate group, and a thiol group.
FUJIWARA TAKENORI
OTAKE ATSUYUKI
TOMIKAWA MASAO
| JP2003252877A | 2003-09-10 | |||
| JP2002088120A | 2002-03-27 | |||
| JPH03249654A | 1991-11-07 | |||
| JPH1062996A | 1998-03-06 | |||
| JPH0292910A | 1990-04-03 | |||
| JP2003066460A | 2003-03-05 |