To provide a laminate having high adhesion strength even in the high speed molding and having high adhesion strength at any of room temperature or a high temperature and a resin composition suitable as an adhesive resin layer of the laminate.

The resin composition contains 30-65 wt.% propylene based modified resin (A) and 70-35 wt% propylene based resin (B). The propylene based resin (A) is obtained by modifying the propylene based resin (a) with an ethylenic unsaturated compound (b) and has 115-135°C melting peak temperature, ≥100 MPa storage modulus at 80°C and a molecular weight distribution (weight average molecular weight/number average molecular weight) of 1.8-2.5.