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Title:
RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING ORIGINAL PLATE FOR LASER ENGRAVING, MANUFACTURING METHOD FOR RELIEF PRINTING ORIGINAL PLATE FOR LASER ENGRAVING, METHOD FOR MANUFACTURING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE
Document Type and Number:
Japanese Patent JP2011136455
Kind Code:
A
Abstract:

To provide a resin composition for laser engraving which exhibits excellent tensile strength and scum removing properties and obtains a relief printing plate free from missing dots, and to provide a relief printing original plate for laser engraving, a method for manufacturing a relief printing original plate for laser engraving, a manufacturing method for a relief printing plate and a relief printing plate.

The resin composition for laser engraving contains (component C1) an ethylenic unsaturated compound, (component C2) at least either a compound with a hydrolyzable silyl group and/or a silanol group, (component A) binder polymer, and (component B) polymer having, as side chain, at least one kind of either an acid group and/or an alkali decomposable group being an acid group obtained through alkali hydrolysis.


Inventors:
YAMASHITA KATSUHIRO
SUGAZAKI ATSUSHI
Application Number:
JP2009296868A
Publication Date:
July 14, 2011
Filing Date:
December 28, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
B41N1/12; B41C1/05
Domestic Patent References:
JP2008119916A2008-05-29
JP2006002061A2006-01-05
Attorney, Agent or Firm:
Yasuhiro Noguchi
Akiko Deep Sea