Title:
RESIN COMPOSITION, MANUFACTURING METHOD OF CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020097747
Kind Code:
A
Abstract:
To provide a resin composition providing a coated film excellent in film thickness uniformity in thick film formation and excellent in adhesiveness to a substrate after development.SOLUTION: The resin composition contains (A) 100 pts.mass of a resin having a structure represented by the general formula (A1) in the figure, (B) 1 to 1,000 pts.mass of one or more amide compounds selected from 3-alkoxy-N,N-dimethylpropionamides, and (D) a photoinitiator.SELECTED DRAWING: None
Inventors:
ANZAI NOBUHIRO
Application Number:
JP2020012911A
Publication Date:
June 25, 2020
Filing Date:
January 29, 2020
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08L79/04; C08K5/20; C08K5/5415; G03F7/004; G03F7/027; G03F7/031; G03F7/075; G03F7/20
Domestic Patent References:
| JP2016069498A | 2016-05-09 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Hideo Katsumata
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Hideo Katsumata