Title:
RESIN COMPOSITION, METHOD OF DECOMPOSING URETHANE RESIN AND URETHANE RESIN DECOMPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2008231181
Kind Code:
A
Abstract:
To provide a method of improving the surface adhesiveness of foreign substances by controlling the concentration of specified components formed on decomposition since the properties of a reclaimed material deteriorate by the foreign substances such as metals and sand mixed into a decomposition fluid when obtained by chemical decomposition of a urethane resin of an actual waste material.
A resin composition comprises 0.1-5 wt.% the sum of compounds represented by chemical formula 1 and chemical formula 2 or structures having an oxazolidinone ring represented by chemical formula 3 and an imidazolidinone ring represented by chemical formula 4 in the reclaimed resin produced from a urethane decomposition product.
Inventors:
FUKAYA TARO
WATARIDO HIROKO
FUJIEDA SHINETSU
YAMAMOTO MASAAKI
WATARIDO HIROKO
FUJIEDA SHINETSU
YAMAMOTO MASAAKI
Application Number:
JP2007070204A
Publication Date:
October 02, 2008
Filing Date:
March 19, 2007
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
C08L75/04; C08G59/40; C08J11/28; C08K5/3445; C08K5/353; C08L63/00; C08L67/00; C08L77/00
Attorney, Agent or Firm:
Mitsuyuki Matsuyama
Tetsuma Ikegami
Tetsuma Ikegami
Previous Patent: SHELLAC RESIN COMPOSITION AND MOLDED PRODUCT FOR ELECTRIC/ELECTRONIC MATERIAL USING THE SAME
Next Patent: INKJET INK
Next Patent: INKJET INK