SHELLAC RESIN COMPOSITION AND MOLDED PRODUCT FOR ELECTRIC/ELECTRONIC MATERIAL USING THE SAME

Japanese Patent JP2008231180

A

To enable procurement of a uniform solid resin composition or a uniform liquid resin composition without using a solvent to obtain a shellac resin composition having high productivity which can be used in various types of molding.

The shellac resin composition uses a shellac resin and a water-soluble epoxy resin as essential components. It is preferred to use a vegetable oil, an organic filler or an inorganic filler in this composition. It is preferred that the above shellac resin is dissolved and mixed into the water-soluble epoxy resin, and the hydrolyzable chlorine of the above shellac resin is not more than 1,000 ppm and the solubility of the aqueous epoxy resin composition in water is not less than 20%. The molded product produced by using this composition is a material having low modulus and high strength and excellent impact resistance and moisture resistance.

WO/1996/004345	BIOLOGICALLY DEGRADABLE MATERIAL, A METHOD OF PRODUCING IT AND USES OF IT
WO/2023/147434	AQUEOUS EMULSIONS CONTAINING SHELLAC PARTICLES AND COATINGS FORMED THEREWITH
JP2016026250	COMPOSITE MATERIAL, ANTIBACTERIAL ARTICLE COMPRISING COMPOSITE MATERIAL, METHOD FOR PRODUCING COMPOSITE MATERIAL AND METHOD FOR PRODUCING ANTIBACTERIAL ARTICLE

FUJIEDA SHINETSU
WATARIDO HIROKO
FUKAYA TARO
MOTOMIYA AKINORI

JP2007070203A

October 02, 2008

March 19, 2007

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TOSHIBA CORP

C08L93/02; C08L63/00; H01L23/29; H01L23/31

Mitsuyuki Matsuyama
Tetsuma Ikegami

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