To provide a resin composition for molding that has low viscosity and low hardness, is excellent in flexibility and moldability, has an excellent property at low temperature (elongation at low temperature) while maintaining adhesion to polyvinyl chloride (PVC), metals, and polybutylene terephthalate (PBT), and is suitable for use as a hot-melt material (a hot-melt material for molding) and/or a potting material (a potting material for sealing).

The resin composition for molding contains an aromatic polyester (a), a tackifier (b), a polyol compound (c) having two or more hydroxy groups in one molecule, and polytetramethylene ether glycol (d). The resin composition for molding contains 1-50 pts.mass of the polytetramethylene ether glycol (d) based on 100 pts.mass of the aromatic polyester (a).