To provide a prepreg having an insulating layer having a high permittivity and several to several tens m thickness, imparted with flexibility in the insulation layer by using a resin composition consisting of a high permittivity filler, and hardly forming defects such as cracks, chips, breaks, etc., even as a single unit, a metal-clad laminated plate, a resin-attached metal foil, an adhesive film and a printed wiring plate.

This resin composition containing a silicone resin and a high permittivity filler, the prepreg obtained by using the above resin composition, metal-clad laminate plate by using the prepreg, resin-attached metal foil and adhesive film obtained by using the resin composition, adhesive film, and printed wiring board by using at least one of the resin composition prepreg, metal-clad laminate board, resin-attached metal foil and adhesive film are also provided.