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Title:
PHOSPHORUS-CONTAINING COMPOUND, RESIN COMPOSITION CONTAINING THE SAME, PHOTOSENSITIVE FILM BY USING RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2008274003
Kind Code:
A
Abstract:

To provide a phosphorus-containing compound capable of securing sufficient flame retardance without using a halogen-based flame retardant, obtaining a sufficient resolution by an alkaline developing liquid, without having the discoloration of surface and blisters at the boundary of copper and a resin on a wiring board in the PCT test, and also sufficiently reducing the problem of bleeding out, a resin composition containing the phosphorus-containing compound, a photosensitive film by using the resin composition, a method for forming a resist pattern and a printed wiring board.

This phosphorus-containing compound containing a vinyl monomer having a phosphorus compound structure in its side chain, a vinyl monomer having a carboxyl group in its side chain and a vinyl monomer having an aryl or ester group in its side chain as structural units, the resin composition containing the compound, the photosensitive film 1 obtained by using the resin composition, the method for forming the resist pattern and the printed wiring board are provide.


Inventors:
MORITA MASAKI
HATAKEYAMA SHUICHI
ARIGA SHIGEHARU
SHINADA EIITSU
Application Number:
JP2007115466A
Publication Date:
November 13, 2008
Filing Date:
April 25, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F230/02; B32B27/18; C07F9/09; C08L43/00; G03F7/004; G03F7/033; H05K3/28
Domestic Patent References:
JP2000112121A2000-04-21
JP2006525407A2006-11-09
JP2007182531A2007-07-19
JPS59100433A1984-06-09
JPS60202111A1985-10-12
JP2008051934A2008-03-06