Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016048788
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a solder resist layer is prevented from being cracked.SOLUTION: A non-volatile component in a resin composition of the solder resist layer and a non-volatile component in a resin composition of a build-up layer are the same in 97 mass% or more. When the non-volatile component in the resin composition of the solder resist layer is 100 mass%, a content of silica is 40 to 85 mass%, a linear thermal expansion coefficient a(ppm) of the solder resist layer at 25 to 150°C and a linear thermal expansion coefficient b(ppm) of the build-up layer at 25 to 150°C satisfy 12≤a≤(b+5)≤30 and an elastic modulus of the solder resist layer at 23°C is 7 GPa or higher, such that the resin composition forming the solder resist layer and the resin composition forming the build-up layer are substantially similarly constituted.SELECTED DRAWING: None
Inventors:
WADA YOSHINORI
HAYASHI EIICHI
NAKAMURA SHIGEO
HAYASHI EIICHI
NAKAMURA SHIGEO
Application Number:
JP2015210436A
Publication Date:
April 07, 2016
Filing Date:
October 27, 2015
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
H05K3/46; B32B27/00; C08L63/00; C08L101/00; H05K3/28
Domestic Patent References:
| JP2006278993A | 2006-10-12 | |||
| JP2003101244A | 2003-04-04 | |||
| JP2003046226A | 2003-02-14 |