樹脂組成物、接着フィルム、および半導体装置

Title:

樹脂組成物、接着フィルム、および半導体装置

Document Type and Number:

Japanese Patent JP6912030

Kind Code:

B2

Abstract:

To provide a resin composition excellent in thermal conductivity, adhesiveness and film formability, particularly a resin composition excellent in thermal conductivity after curing.SOLUTION: The resin composition includes (A) an aminophenol type epoxy resin, (B) at least one kind selected from the group consisting of a phenoxy resin and a thermoplastic elastomer and (C) a highly thermally conductive inorganic filler. The dry matter of the resin composition can form a film having a film thickness of 30 to 200 μm and when a substrate with a dry matter of the resin composition having a film thickness of 30 to 200 μm and a width of 20 cm is wound on a reel of 50 mmφ, the substrate will not be fragmented even if it is bent.SELECTED DRAWING: None

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Inventors:

Hiroshi Takasugi
Kurokawa Tsu Yoshi
Toshima Jun
Issei Aoki
Shin Teraki

Application Number:

JP2019025811A

Publication Date:

July 28, 2021

Filing Date:

February 15, 2019

Export Citation:

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Assignee:

Namics Co., Ltd.

International Classes:

C08L63/00; C08G59/50; C08K3/01; C08K3/22; C08L33/08; C08L71/10; C09J7/30; C09J11/04; C09J133/08; C09J163/00; C09J171/10

Domestic Patent References:

JP2009224109A
JP2012067220A
JP2005187508A
JP2011168672A
JP2012092297A

Foreign References:

WO2013183303A1
WO2012073360A1

Attorney, Agent or Firm:

Yusuke Watanabe

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