Title:
樹脂組成物、樹脂シート、積層体、及び半導体素子
Document Type and Number:
Japanese Patent JP7034232
Kind Code:
B2
Abstract:
A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.
Inventors:
Yasunori Karasawa
Application Number:
JP2020183914A
Publication Date:
March 11, 2022
Filing Date:
November 02, 2020
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C08L71/10; B32B18/00; C08J5/18; C08K3/013; C08K5/3415; H01L23/29; H01L23/31
Domestic Patent References:
| JP2013170266A | ||||
| JP2015147849A |
Attorney, Agent or Firm:
Intellectual Property Office