Title:
RESIN COMPOUND FOR COMPOSING INSULATING INTERLAYER OF PRINT CIRCUIT BOARD, RESIN SHEET FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND AND COPPER-PLATED LAMINATE USING THEM
Document Type and Number:
Japanese Patent JP2002179772
Kind Code:
A
Abstract:
To obtain a copper foil with resin free of halogen elements, having high flame-retardancy, excellent waterproofness and heat resistance, and good peeling off strength between a substrate and copper foil.
This resin compound used for composing insulating interlayer of a print circuit board comprises an epoxy-based resin containing a curing agent for epoxy resin which has 5 to 25 wt.% nitrogen, a maleimide compound having thermosetting ability and free from halogen elements.
Inventors:
SATO TETSURO
ASAI TSUTOMU
ASAI TSUTOMU
Application Number:
JP2000374070A
Publication Date:
June 26, 2002
Filing Date:
December 08, 2000
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C08L29/14; C08G59/40; C08G59/62; C08L63/00; C08L71/10; C08L81/06; H01L23/14; H05K3/46; (IPC1-7): C08G59/62; C08L29/14; C08L63/00; C08L71/10; C08L81/06; H01L23/14
Attorney, Agent or Firm:
Daisuke Tanaka
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