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Title:
RESIN DISPERSION AND ADHESIVE
Document Type and Number:
Japanese Patent JP2011178861
Kind Code:
A
Abstract:

To provide a resin dispersion providing excellent adhesiveness and low-temperature heat-sealability when used as an adhesive, and capable of sticking a polyolefin-based resin with a metal by low-temperature and short-time heating, to provide a laminate having excellent light shielding properties, gas-barrier properties or the like, further having suitability for protecting contents, and useful for packing and packaging mainly a retort food, snack cakes, oils and fats, a medicine, miscellaneous goods, an industrial member, etc., and to provide a bag for packaging and a packaging container obtained by forming the laminate.

The resin dispersion is obtained by dispersing, in an aqueous medium, a polymer (D) obtained by bonding an unsaturated carboxylic acid (B) to a polyolefin (A) having a weight average molecular weight Mw of ≥10,000 and ≤100,000 so that the acid-modification rate may be >1.3% and <10%, further bonding a hydrophilic polymer (C) in a proportion of (A):(C) of from 100:1 to 100:100 thereto.


Inventors:
HARADA AKIRA
SEKO TOSHIYA
Application Number:
JP2010043364A
Publication Date:
September 15, 2011
Filing Date:
February 26, 2010
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08J3/05; C08F8/00; C08F10/06; C08G81/02; C09J123/00; C09J151/06; C09J153/00
Domestic Patent References:
JP2007246871A2007-09-27
JP2007270122A2007-10-18
JP2008031360A2008-02-14
JP2008163289A2008-07-17