Title:
樹脂材料、積層フィルム及び多層プリント配線板
Document Type and Number:
Japanese Patent JP7323314
Kind Code:
B2
Abstract:
To provide a resin material which 1) enhances embedding properties to an uneven surface, 2) suppresses excess squeeze out from a periphery of a substrate of a resin material during lamination, 3) keeps curing temperature low, 4) reduces dielectric loss tangent of a cured article, 5) enhances adhesiveness with a metal, and 6) can enhance bending stability of the cured article.SOLUTION: The resin material contains a polyimide compound, and at least one of aliphatic skeleton-containing compound of a maleimide compound having an aliphatic skeleton and a benzoxazine compound having the aliphatic skeleton.SELECTED DRAWING: Figure 1
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Inventors:
Yuko Kawahara
Tatsufumi Hayashi
Toshiaki Tanaka
Tatsufumi Hayashi
Toshiaki Tanaka
Application Number:
JP2019061453A
Publication Date:
August 08, 2023
Filing Date:
March 27, 2019
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08G59/40; B32B15/08; B32B15/092; B32B27/38; C08G83/00; C08K3/013; C08K5/16; C08K5/49; C08L63/00; C08L79/08; H05K1/03; H05K3/46
Domestic Patent References:
| JP2014132066A | ||||
| JP2007119507A | ||||
| JP2012528236A | ||||
| JP2013199645A | ||||
| JP2017119361A |
Foreign References:
| WO2018237377A1 | ||||
| WO2008010514A1 | ||||
| WO2018008643A1 |
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office