To provide a resin member with high plasma resistance to be used inside a plasma processing device for a manufacturing process of semiconductors, flat panel displays and the like.

The resin member is provided with a ceramic thermal spray film, which is high in adhesive force to the resin substrate, is uniform and has few voids and is excellent in plasma resistance, made by coating a resin substrate with a polysilazane solution and heating the resulting substrate to form a silica coating having a film thickness of 0.05 to 1.0 μm and forming a thermal spray film of a film thickness of 30 to 300 μm by using a ceramic containing not less than 20 atomic% of a group IIa element and/or a group IIIa element in terms of metallic element concentration on the silica coating.