Title:
RESIN MOLDED ITEM AND ITS MANUFACTURE AND DEVICE FOR MANUFACTURING IT
Document Type and Number:
Japanese Patent JP3442877
Kind Code:
B2
Abstract:
PURPOSE: To enable easy manufacturing and to reduce a manufacturing cost by constituting the item of a hollow resin molded part of a specified size and a shield part which is provided all over a plane inside a middle part of the resin molded part and cuts off electromagnet.
CONSTITUTION: A cover board 21A used in a front part of a large information processing device, etc., as a resin molded item and a cover part 22 which is a resin molded part are formed hollow and a conductor 23 which is a shield member is provided all over inside. A proper opening part 24a and a projecting and recessed part 24b are formed in the cover part 22. Since electromagnet is cut off by providing the conductor 23 such as a wire netting body whose peripheral edge is closely fixed inside a hollow part of the hollow cover body 21A, the conductor 23 is positioned inside the hollow part of the cover body 21A. Therefore, manufacturing is easy and a manufacturing cost can be reduced.
Inventors:
Gaku Yamamoto
Application Number:
JP24646894A
Publication Date:
September 02, 2003
Filing Date:
October 12, 1994
Export Citation:
Assignee:
富士通株式会社
International Classes:
B29C49/00; B29C49/20; B29C69/00; B29C70/74; C08L101/00; C09D201/00; C09J201/00; G06F1/18; H05K9/00; B29C49/04; (IPC1-7): H05K9/00; B29C49/20
Domestic Patent References:
| JP2125730A | ||||
| JP6063149A | ||||
| JP59129126A | ||||
| JP60158699A | ||||
| JP5259682A | ||||
| JP1161895A | ||||
| JP62238709A | ||||
| JP272600U | ||||
| JP31499U | ||||
| JP63201391U |
Attorney, Agent or Firm:
Tadahiko Ito