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Title:
RESIST MATERIAL, CHEMICALLY AMPLIFYING RESIST, AND METHOD FOR FORMING PATTERN BY USING THE SAME
Document Type and Number:
Japanese Patent JP2004171024
Kind Code:
A
Abstract:

To provide a resist resin and a chemically amplifying resist having high transparency for light of far UV rays of about ≤220 nm wavelength, high etching durability and excellent adhesiveness with a substrate, and to provide a method for forming a pattern by using the resist.

The resist resin increases its solubility with an alkali aqueous solution by decomposition of an acid decomposing group by the effect of an acid and has an alicyclic lactone structure expressed by general formula (1) in the main chain. In formula (1), Z represents an alicyclic hydrocarbon group having a lactone structure.


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Inventors:
MAEDA KATSUMI
IWASA SHIGEYUKI
NAKANO KAICHIRO
HASEGAWA ETSUO
Application Number:
JP2004032766A
Publication Date:
June 17, 2004
Filing Date:
February 09, 2004
Export Citation:
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Assignee:
NEC CORP
International Classes:
G03F7/039; C08F32/08; H01L21/027; (IPC1-7): G03F7/039; C08F32/08; H01L21/027
Attorney, Agent or Firm:
Seisei Nishimura



 
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