Title:
RESIST MATERIAL AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP3865048
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resist material, particularly a chemical amplification positive type resist material having higher sensitivity, resolution, exposure margin and process adaptability than a conventional resist material, ensuring a good pattern shape after exposure and exhibiting superior etching resistance and to provide a pattern forming method.
SOLUTION: The resist material contains a high molecular compound containing repeating units in which each acid labile group is decomposed by the action of an acid to increase alkali solubility as well as repeating units of formula (1) (where R1 and R2 are each H, hydroxy, substitutable hydroxyalkyl, linear or branched alkyl, substitutable alkoxy or halogen and (n) is 0 or a positive integer of 1-4) and having a weight average molecular weight of 1,000-500,000.
Inventors:
Takanobu Takeda
Jun Hatakeyama
Osamu Watanabe
Hiroshi Kubota
Jun Hatakeyama
Osamu Watanabe
Hiroshi Kubota
Application Number:
JP2001325907A
Publication Date:
January 10, 2007
Filing Date:
October 24, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
G03F7/039; C08F32/08; C08L45/00; G03F7/004; G03F7/38; H01L21/027; (IPC1-7): G03F7/039; C08F32/08; G03F7/004; G03F7/38; H01L21/027
Domestic Patent References:
| JP4249509A | ||||
| JP11338153A | ||||
| JP2000098612A | ||||
| JP10142799A | ||||
| JP6043646A | ||||
| JP10090887A | ||||
| JP11119018A | ||||
| JP10265524A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa
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