Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ソーワイヤー及び切断装置
Document Type and Number:
Japanese Patent JP7223964
Kind Code:
B2
Abstract:
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 μm. A diameter of the metal wire is at most 60 μm.

Inventors:
Tomohiro Kanazawa
Masato Wada
Takayuki Imai
Tetsuji Shibata
Kazushige Sugita
Naoki Kamiyama
Hiroshi Goda
Yoshitaka Mizuguchi
Application Number:
JP2017094230A
Publication Date:
February 17, 2023
Filing Date:
May 10, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B24D11/00; B24B27/06; B24D3/06; B28D5/04; H01L21/304
Domestic Patent References:
JP2011137213A
JP2007203393A
JP6063076B1
JP2001312952A
JP4263098B2
JP2015155119A
JP51035189A
JP2014188655A
JP6273624B1
Foreign References:
US20110009039
US20020145373
Attorney, Agent or Firm:
Hiroi Arai
Teraya Eisaku
Shinichi Michizaka



 
Previous Patent: partition

Next Patent: METHOD RESISTANT AGAINST CANCER