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Patent Searching and Data


Title:
SCRAPING DEVICE AND SCRAPING METHOD
Document Type and Number:
Japanese Patent JPH11207477
Kind Code:
A
Abstract:

To efficiently achieve the machining of high accuracy without requiring any expensive tool irrespectively of the hardness of a work to be machined by irradiating the relatively moving work with the converged laser beam, and melting or evaporating and removing the surface of the work in a recess.

The laser beam L to be outputted from a laser beam oscillator 1 is converged by a collective lens 3, and a work W is irradiated therewith. The work W on an XY work table device 10 of an NC machine 11 is moved in X and Y directions and machined to an arbitrary shape. The laser beam L is preferably th laser beam of the frequency twice that of the outputted generated by the Q switch oscillation of a YAG laser beam oscillator. The scraping shape is preferably an assembly of bottomed pierced holes, an assembly of grooves by the intermittently oscillated pulse, assembly of combination of circular grooves, an assembly of combination of elliptical grooves, or a lattice groove.


Inventors:
KANEHARA YOSHIHIDE
TANAKA HISAO
USUI AKIRA
Application Number:
JP1263298A
Publication Date:
August 03, 1999
Filing Date:
January 26, 1998
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/08; B23K26/36; B23K26/364; (IPC1-7): B23K26/00; B23K26/08
Attorney, Agent or Firm:
Hiroaki Sakai (1 person outside)