Title:
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JP2022021902
Kind Code:
A
Abstract:
To provide a sealing resin composition that gives a cured product having a good balance between dielectric loss tangent and heat resistance, an electronic component device sealed therewith, and a method for producing an electronic component device to be sealed therewith.SOLUTION: A sealing resin composition contains an epoxy resin and a curing agent, the curing agent including an active ester compound and an isocyanurate polyisocyanate compound.SELECTED DRAWING: None
Inventors:
TANAKA MIKA
Application Number:
JP2020125775A
Publication Date:
February 03, 2022
Filing Date:
July 22, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08G59/40; H01L23/29
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office