Title:
SEALING RESIN COMPOSITION FOR ORGANIC ELECTROLUMINESCENT ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, AND METHOD FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT
Document Type and Number:
Japanese Patent JP2004111380
Kind Code:
A
Abstract:
To provide an organic electroluminescent element capable of sufficiently and stably suppressing an increase in dark spot over time and a method for manufacturing the element.
The sealing resin composition includes an epoxy compound having a softening point of 50 °C or above. The epoxy compound is expressed by the following formula (1), wherein Ar represents a substituent or a non-substituent aromatic ring, m is a positive integer, X represents a linkage chain selected from or a combination of a single-bond, substituent , or non-substituent alkyl chain, a substituent or non-substituent aromatic ring chain, a substituent or non-substituent fatty ring chain.
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Inventors:
IKEDA TAKESHI
FUJIMORI SHIGEO
OKA TETSUO
FUJIMORI SHIGEO
OKA TETSUO
Application Number:
JP2003301081A
Publication Date:
April 08, 2004
Filing Date:
August 26, 2003
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
H05B33/04; C08G59/06; H01L51/50; H05B33/14; (IPC1-7): H05B33/04; C08G59/06; H05B33/14