Title:
SEALING RESIN SHEET AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
Japanese Patent JP2023023704
Kind Code:
A
Abstract:
To provide a sealing resin sheet for sealing an electronic component chip that is mounted on a substrate in the state of facing the substrate through a gap which is suitable for achieving both high heat dissipation property and good hollow sealing property, and an electronic component device.SOLUTION: A sealing resin sheet X has a sealing resin layer 11, and a sealing resin layer 12 in this order in a thickness direction H. The sealing resin layer 11 contains a first thermosetting resin, a laminar silicate compound, and a first inorganic filler other than the laminar silicate compound. The sealing resin layer 12 contains a second thermosetting resin and a second inorganic filler. The sealing resin sheet X has thermal conductivity of 2 W/m K or more after curing. An electronic component device Y includes a substrate S, an electronic component chip 21 that is mounted on a substrate S in the state of facing the substrate S through a gap G, and a cured resin part 10 which is formed of the sealing resin sheet X, and seals the electronic component chip 21 and the gap G.SELECTED DRAWING: Figure 1
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Inventors:
HABU TSUYOSHI
HAMANA DAIKI
SHIMIZU YUSAKU
HAMANA DAIKI
SHIMIZU YUSAKU
Application Number:
JP2021129473A
Publication Date:
February 16, 2023
Filing Date:
August 06, 2021
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/29; B32B7/027; B32B27/20; C08K3/34; C08L101/00; C09J5/06; C09J7/30; C09J11/04; C09J201/00; H01L21/56; H01L23/08; H05K3/28
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda