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Title:
基板材料にプラスチックホイルを貼付するためのシーリングユニット
Document Type and Number:
Japanese Patent JP4762595
Kind Code:
B2
Abstract:
A sealing unit (8) comprises a sealing plate (11) with heated active surface and back plate (9), die cutting unit (16) with die cutting knife (15), and counter plate for making die cuts at selected locations in the planar substrate material in the region of the applied plastic foil. The sealing plate has set(s) of raised and depressed regions on its active surface. A sealing unit comprises a sealing plate with heated active surface and back plate, die cutting unit with die cutting knife, and counter plate for making die cuts at selected locations in the planar substrate material (1) in the region of the applied plastic foil (7). The sealing plate generates heat and pressure to the substrate material during the sealing process. It has set(s) of raised regions (14) and depressed regions (13) on its active surface facing the back plate and the location of the depressed regions in the sealing plate corresponds to the location of the die cutting knife, so that cut is made at the selected positions in the substrate material where, because of the depressed regions of the sealing plate, there is reduced heating of the substrate material and associated laminations.

Inventors:
Stefan, Polster
Application Number:
JP2005111617A
Publication Date:
August 31, 2011
Filing Date:
April 08, 2005
Export Citation:
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Assignee:
Tetra Laval Holdings and Finance SA
International Classes:
B65B51/10; B29C65/04; B65B51/14; B65B61/00
Domestic Patent References:
JP2003011908A
JP63012405A
Foreign References:
DE4432718A1
US5452849
US5766385
US6649011
EP1086899A1
EP0848937A1
Attorney, Agent or Firm:
Shinichi Ogawa
Takashi Noguchi
Kazuhiko Saishita