PURPOSE: To lessen the effect of temperature fluctuation by a method wherein a supporting part is provided as it remains free from contact with a fixed board, and the supporting part is coupled at least to a side of a frame part by a coupling part.
CONSTITUTION: A frame part 31 of a square frame shape, a thinly formed beam (second coupling part) 35, a supporting part 34, two beams 33 (first coupling part) and an overlapped part 32 are formed on a silicon semiconductor board 3. The beam 35 has elasticity, and the supporting part 34 and the whole part of a side of the frame part 31 are coupled on the upper part of a side of the frame part 31. The beam 33 has elasticity, and it supports the overlapped part 32 from the upper side of the supporting part 34. When thermal strain is generated by the change of circumferential temperature, the upper and the lower surfaces of the supporting part 34 are only brought in contact with the upper and the lower fixing boards 2 and 4, and they are not fixed. Accordingly, even when the frame part 31 and the upper and the lower fixing boards 2 and 3 are deformed by thermal strain, the deformation is absorbed by the elastic beam 35, the supporting part 34 is not deformed and inclined, and it is maintained almost in the initial state.
OBA MASATOSHI
HIKASA KOICHI
