Title:
半導体冷却装置
Document Type and Number:
Japanese Patent JP7068097
Kind Code:
B2
Abstract:
To provide a semiconductor cooling device capable of preventing a wrapping of a heat dissipation substrate while obtaining an excellent cooling performance.SOLUTION: A semiconductor cooling device bonded to a semiconductor module 2 on which a semiconductor element 42 is mounted via a wiring layer on one surface of an insulation substrate 40, comprises: a heat dissipation substrate 10 bonded to the other surface side of the insulation substrate 40; a plurality of fins 11 provided onto a surface opposite to the insulation substrate side in the heat dissipation substrate 10; a wrapping prevention board 20 bonded to a tip of each fin 11, and formed by a material having a linear expansion coefficient smaller than that of a material of the heat dissipation substrate 10; and a jacket 30 mounted onto the surface side where each fin of the heat dissipation substrate 10 is provided, and in which a cooling medium flow space is formed by housing each fin 11 from the heat dissipation substrate 10. The wrapping prevention board 20 comprises: a substrate 20a; and a projection part 20b provided to at least one part of the surface on the side opposite to the heat dissipation substrate side in the substrate.SELECTED DRAWING: Figure 2
Inventors:
Seiji Matsushima
Tomoya Hirano
Tomoya Hirano
Application Number:
JP2018152824A
Publication Date:
May 16, 2022
Filing Date:
August 15, 2018
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2016219572A | ||||
| JP2012156322A | ||||
| JP2011108683A | ||||
| JP2017092468A |
Foreign References:
| WO2014045758A1 | ||||
| US20110108247 |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Hisayoshi Shimizu
Ken Takada