Title:
SEMICONDUCTOR DEVICE HAVING FUSE AND CAPACITOR POSITIONED AT SAME LEVEL AND MANUFACTURING METHOD OF SAME
Document Type and Number:
Japanese Patent JP2005101618
Kind Code:
A
Abstract:
To provide a semiconductor device provided with a fuse and a capacitor while minimizing photographic and etching processes provided with the fuse and a MIM capacitor and a manufacturing method of the same.
The semiconductor device includes a semiconductor substrate having a fuse area and a capacitor area. The fuse is disposed on the fuse area, and a lower plate positioned on the same plane as in the fuse is disposed on the capacitor area. An upper plate is positioned on the upper section of the lower plate, and a capping layer is interposed between the lower plate and the upper plate.
Inventors:
PARK SEUNG-HAN
LEE KI-YOUNG
LEE KI-YOUNG
Application Number:
JP2004278476A
Publication Date:
April 14, 2005
Filing Date:
September 24, 2004
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L23/52; H01L21/02; H01L21/3205; H01L21/82; H01L21/822; H01L21/8242; H01L23/522; H01L23/525; H01L27/04; H01L27/08; H01L27/10; H01L27/108; (IPC1-7): H01L21/822; H01L21/3205; H01L21/82; H01L21/8242; H01L27/04; H01L27/108
Domestic Patent References:
| JPS59200453A | 1984-11-13 | |||
| JP2001308280A | 2001-11-02 | |||
| JP2002110799A | 2002-04-12 | |||
| JP2003163268A | 2003-06-06 | |||
| JP2005529482A | 2005-09-29 | |||
| JPH11195753A | 1999-07-21 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe
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