Title:
WAFER BONDING DEVICE AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP2005101617
Kind Code:
A
Abstract:
To provide another method and another device for bonding wafers.
The present invention relates to a method of bonding two wafers in a chamber 10. In the method, two wafers 22 and 26 are placed in parallel and separately, surfaces of wafers to be bonded 22o, 26o are plasma activated while the interior of the exhausted chamber 10 is maintained at a certain pressure, and the surfaces of wafers to be bonded 22o, 26o are then bonded along their lengths after the pressure in the chamber 10 is increased and purge is performed with inert gas.
Inventors:
THALLNER ERICH
Application Number:
JP2004278474A
Publication Date:
April 14, 2005
Filing Date:
September 24, 2004
Export Citation:
Assignee:
THALLNER ERICH
International Classes:
H01L21/02; H01J37/20; H01J37/304; H01J37/315; H01L21/00; H01L21/20; H01L21/30; H01L21/46; H01L21/58; (IPC1-7): H01L21/02
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Masakazu Aoyama
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Masakazu Aoyama
Yasuhiko Murayama
Shinya Mitsuhiro
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