Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2001068620
Kind Code:
A
Abstract:
To provide a semiconductor device, wherein wiring distance is shortened, and a method for manufacturing it, a circuit board and an electronic equipment.
A semiconductor device contains a board 10 wherein a wiring pattern 12 is formed on one surface thereof, and a plurality of semiconductor chips 20 and 30 that are mounted on the board 10 and connected electrically to the wiring pattern 12. A pair of parts 15 and 17 of the wiring pattern 12 are joined to each other. That is, since a pair of parts 15 and 17 of the wiring pattern 12 are joined, electrical connection is accomplished with the joint part in between. As a result, wiring distance is shortened.
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Inventors:
HASHIMOTO NOBUAKI
Application Number:
JP24452099A
Publication Date:
March 16, 2001
Filing Date:
August 31, 1999
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L25/18; H01L21/60; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L21/60
Attorney, Agent or Firm:
Hajime Inoue (2 outside)
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