PURPOSE: To reduce the resistance of via hole in a fixed circuit section by employing a constitution of a contact section connecting an upper wiring and a lower wiring that the generalized fixed circuit section does not include a barrier metal and only anti-fusing section allows the formation of barrier metal.

CONSTITUTION: A lower insulating film 2, a lower wiring film 3 and a lower barrier metal film 4 are sequentially laminated on a substrate 1. The via hole region of a layer insulating film 5 with the upper wiring is patterned to leave a lower layer barrier metal film 4 at the bottom part of the anti-fusing via hole 6. A fusing material 7 covers the anti-fusing via hole 6 and the upper layer barrier metal film 8 formed on it is then patterned. Finally, a wiring connection via hole 9 is formed and an upper wiring film 10 is then formed so that the lower layer barrier metal film 4 is not left at the bottom portion. Thereby, a low resistance can be realized, avoiding the factors of delay as the circuit.