SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Title:

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2005064118

Kind Code:

A

Abstract:

To provide an inexpensive semiconductor device which is enhanced in heat dispersion characteristics and easily manufactured, and also to provide its manufacturing method.

The semiconductor device is provided with a package substrate 1 having a solder bump 2 connected with the terminal of a semiconductor chip 3, the semiconductor chip 3 connected facedown to the solder bump 2 of the package substrate, a heat spreader 8 having the size including the semiconductor chip 3 in a planar view and located on the semiconductor chip 3, and a heat dispersing adhesion layer 9 which is interposed between the semiconductor chip 3 and the heat spreader 8 and adheres both of them. A support member, which supports the heat spreader 8 to the package substrate 1, is not provided between the heat spreader 8 and the package substrate 1 around the semiconductor chip 3.

Inventors:

GO TSUTOMU

Application Number:

JP2003290193A

Publication Date:

March 10, 2005

Filing Date:

August 08, 2003

Export Citation:

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Assignee:

RENESAS TECH CORP

International Classes:

H01L23/12; H01L23/34; H01L23/367; (IPC1-7): H01L23/34; H01L23/12

Attorney, Agent or Firm:

Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai

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