To provide a semiconductor device whose inspection can be performed easily and which can dispense with underfill.

A bare die 10 is mounted in grid array on a printed wiring board 11. A connection land 12 is provided on the surface of the printed wiring board 11, and this connection land 12 and an external electrode 7 are connected with each other through a solder layer 13. This way, the mounting structure is constituted. Accordingly, it is possible to optionally set the arrangement of the external electrode 7 by properly changing the pattern of rewiring 6. Therefore, it becomes possible to perform the inspection of the bare die 10 using a socket for test on the market, and an inspected package can be obtained easily. Moreover, since the wiring layer 2 is covered with a photosensitive resin layer 5 constituting a rewiring layer 8, the underfill which has been required in the past in mounting becomes needless.