Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPS5840840
Kind Code:
A
Abstract:
PURPOSE:To greatly reduce end part damages in an adhesion process, by forming roundness on the peripheral end part of an element pellet wherewith a device is constituted, when manufacturing a semiconductor device by using GaAs, Si, Ge, etc. CONSTITUTION:Roundness is formed on the end parts 9 and 9' of a semiconductor pellet 3' wherein an oxide protecting film 5 and an electrode 6 located thereon are provided on the surface by using an appropriate jig. In this manner, even if the pellet 3' is covered with a die collet 6 having a suction inlet 2, and a space generated under the collect 6 is pressure-reduced when moving the pellet 3', damages are not generated on end parts 9, 9' of the pellet 3'.
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Inventors:
MINAMIGUCHI YOSHIYUKI
Application Number:
JP13893381A
Publication Date:
March 09, 1983
Filing Date:
September 03, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Domestic Patent References:
| JPS55130158A | 1980-10-08 | |||
| JPS5386569A | 1978-07-31 | |||
| JPS5116869A | 1976-02-10 | |||
| JP43025363A | ||||
| JPS546768A | 1979-01-19 | |||
| JPS5039045A | 1975-04-10 |
Attorney, Agent or Firm:
Uchihara Shin