Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2004349593
Kind Code:
A
Abstract:
To provide a semiconductor device which can have a highly reliable BGA (ball grid array) by preventing line disconnection or deterioration of step coverage.
A pad electrode 53 is formed on the surface of a silicon chip 51A. A via hole VH is provided to pass through the silicon chip 51A from its back side and reach a pad electrode 11. A wiring layer 64 on the back surface of the silicon chip 51A is passed through the via hole VH to be electrically connected to the pad electrode 53. And the wiring layer 64 covers a silicon projected part 58 on the back surface of the silicon chip 51A, and a solder ball 66 is formed on a part of the wiring layer 64 on the silicon projected part 58.
Inventors:
TAKAO YUKIHIRO
Application Number:
JP2003147146A
Publication Date:
December 09, 2004
Filing Date:
May 26, 2003
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
H01L23/52; H01L21/3205; H01L23/12; H01L23/31; H01L23/48; H01L23/485; (IPC1-7): H01L23/12; H01L21/3205
Attorney, Agent or Firm:
Katsuhiko Sudo
Takashi Okada
Takashi Okada