Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2021118252
Kind Code:
A
Abstract:
To provide a semiconductor device capable of suppressing an increase in the number of manufacturing processes on wiring, and a method for manufacturing the same.SOLUTION: According to one embodiment, a semiconductor device comprises a substrate, and first and second semiconductor layers extending in a first direction perpendicular to a surface of the substrate. Further, the semiconductor device comprises a first plug provided on the first semiconductor layer and a second plug provided on the second semiconductor layer, and connection wiring including an upper surface having the same height as upper surfaces of the first and second plugs, and a lower surface having the same height as lower surfaces of the first and second plugs. In addition, the semiconductor device comprises first wiring provided on the first plug and the connection wiring, and second wiring provided on the second plug and the connection wiring.SELECTED DRAWING: Figure 5
Inventors:
UCHIUMI TETSUAKI
Application Number:
JP2020010348A
Publication Date:
August 10, 2021
Filing Date:
January 24, 2020
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L27/11582; H01L21/336; H01L21/768; H01L23/522; H01L27/11519; H01L27/11556; H01L27/11565; H01L29/788; H01L29/792
Attorney, Agent or Firm:
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi
Satoru Asakura
Takeshi Sekine
Akaoka Akira
Jie Yamanoi