Title:
SEMICONDUCTOR ELEMENT, PACKAGING STRUCTURE OF THE SAME, AND THERMAL PRINT HEAD
Document Type and Number:
Japanese Patent JP2023109505
Kind Code:
A
Abstract:
To provide a semiconductor element which is suitable for preventing failure in a flip-chip packaging.SOLUTION: A driving IC6 (a semiconductor element) includes: an element body 61 having a first surface 611 directed in a z direction (a thickness direction); a first wiring layer 62 disposed on the first surface 611; and an insulator film 63 disposed on the first wiring layer 62. The first wiring layer 62 includes multiple first pad parts 622. The insulator film 63 has multiple openings 631 each of which exposes the first pad part 622. The driving IC6 further includes: multiple conductive joint parts 64 respectively laminated on the first pad parts 622; and raising parts 65 laminated on the insulator film 63 and protruding in the z direction farther than the insulator film 63.SELECTED DRAWING: Figure 6
Inventors:
NAKAYA GORO
Application Number:
JP2022011055A
Publication Date:
August 08, 2023
Filing Date:
January 27, 2022
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B41J2/345; B41J2/34
Attorney, Agent or Firm:
Hisashi Usui
Shintaro Suzuki
Shintaro Suzuki