Title:
半導体装置、電力変換装置及び移動体
Document Type and Number:
Japanese Patent JP7150183
Kind Code:
B2
Abstract:
Failure analysis and recycle of a semiconductor device are facilitated, and a production efficiency of the semiconductor device is improved. An exterior includes an inner space and an inner surface surrounding the inner space. A semiconductor chip is housed in the inner space and mounted on the inner surface. A first sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, and is made up of silicone gel. A waterproof water-repellent layer is housed in the inner space, disposed on the inner surface to be overlapped on the semiconductor chip and the first sealing material, and made up of fluorine-series resin or silicone-series resin. A second sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, the first sealing material, and the waterproof water-repellent layer, and is made up of silicone gel.
Inventors:
Yukimasa Hayashida
Application Number:
JP2021541389A
Publication Date:
October 07, 2022
Filing Date:
August 20, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/10; H01L23/28; H01L25/07; H01L25/18
Domestic Patent References:
| JP2014150204A |
Foreign References:
| WO2014097798A1 |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita