Title:
電力用半導体モジュール及び電力変換装置
Document Type and Number:
Japanese Patent JP7150184
Kind Code:
B2
Abstract:
A power semiconductor module includes a semiconductor switching element, a gate control pattern to which a gate electrode of the semiconductor switching element is connected, a source control pattern to which a source electrode of the semiconductor switching element is connected, a capacitor to form a low-pass filter, a capacitor arrangement pattern to which one end of the capacitor is connected, and a wire. The other end of the capacitor is connected to the source control pattern. The wire electrically connects the capacitor arrangement pattern and the gate control pattern.
More Like This:
| WO/2018/073965 | SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE |
| WO/2014/030760 | DEVICE AND METHOD OF MANUFACTURING THE SAME |
| JPS60251653 | SEMICONDUCTOR DEVICE |
Inventors:
Junichi Nakajima
Application Number:
JP2021541844A
Publication Date:
October 07, 2022
Filing Date:
August 27, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18; H02M1/08; H02M7/48
Domestic Patent References:
| JP2017011081A | ||||
| JP2019017112A |
Foreign References:
| WO2018056213A1 | ||||
| WO2019044748A1 |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office