To provide a semiconductor device which can improve the thermal fatigue lifetime by reducing the distortion of a connecting member caused by mutual thermal deformation difference between a lead electrode and a semiconductor chip both of which are electrically connected by the connecting member, and can improve power feeding capacity and heat radiating performance of the semiconductor chip.
The semiconductor device includes a semiconductor chip mounted on the inner upper surface of a case electrode by a connection member, a lead mounted on the upper surface of the semiconductor chip by the connecting member, and an insulating member filled in a space of the case electrode for sealing a connected part. By forming a groove in the upper surface of the lead electrode, large thermal distortion occurring at the end of the connecting member caused by the difference in coefficients of linear expansion between the lead electrode and semiconductor chip can be reduced, and the thermal fatigue lifetime can be improved. Also variation in the thickness of the connecting member can be reduced.
MATSUYOSHI SATOSHI
NAKAJIMA TSUTOMU
